Besi - die sorting, die bonding, packaging and plating equipment for semiconductor industry | |
Besi and its product groups Datacon, Esec, Fico and Meco are supplier of die sorting, flip chip and multi chip die bonding, packaging and plating equipment for the semiconductor industry. | |
Keywords : Die Sorter, Flip Chip, Die Bonder, Advanced Packaging, Packaging, Plating, Epoxy, LED, Wire Bonder, Solar | |
H1 tags : Besi | |
H2 tags : Welcome to the world of Besi |
Last Update : | 25/December/2011 |
Google PR : | 5 |
Internal links : | 81 |
External links : | 1 |
Archive : | Check how did the site look in the past? |